The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Nov. 25, 2015
Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventors:

Naoyuki Tanaka, Ibaraki, JP;

Yuichi Tsujita, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/122 (2006.01); G02B 6/43 (2006.01); G02B 6/136 (2006.01); G02B 6/138 (2006.01); H05K 1/02 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4281 (2013.01); G02B 6/122 (2013.01); G02B 6/43 (2013.01); H05K 1/0274 (2013.01); H05K 3/06 (2013.01); G02B 6/136 (2013.01); G02B 6/138 (2013.01); G02B 6/4214 (2013.01); H05K 1/0278 (2013.01); H05K 2201/09036 (2013.01);
Abstract

An opto-electric hybrid board includes: an electric circuit board including an insulation layer and electrical interconnect lines formed on the front surface of the insulation layer; and an optical waveguide provided on the back surface side of the insulation layer of the electric circuit board, with a metal layer therebetween. At least one opening is formed by removing at least part of a region of the metal layer which is overlaid on the contour of an end portion of the optical waveguide. The optical waveguide is formed, with part of the optical waveguide extending into the opening. The opto-electric hybrid board is favorably usable over a prolonged period because the end portion of the optical waveguide provided on the back surface side of the electric circuit board does not peel off the metal layer.


Find Patent Forward Citations

Loading…