The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Mar. 26, 2013
Applicants:

Mitsubishi Rayon Co., Ltd., Tokyo, JP;

Nippon Light Metal Company, Ltd., Tokyo, JP;

Inventors:

Katsuhiro Kojima, Yokohama, JP;

Hiroshi Onomoto, Otake, JP;

Hiroaki Kita, Inazawa, JP;

Kota Shirai, Shizuoka, JP;

Hiroshi Okada, Shizuoka, JP;

Kazume Mochizuki, Shizuoka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22F 1/00 (2006.01); G02B 5/02 (2006.01); C22C 21/00 (2006.01); C22C 21/06 (2006.01); C22F 1/047 (2006.01); G02B 1/118 (2015.01); B29D 11/00 (2006.01); C25D 11/08 (2006.01); C25D 11/12 (2006.01); C25D 11/16 (2006.01); C25D 11/24 (2006.01); C22F 1/04 (2006.01); B22D 25/02 (2006.01); B29C 43/02 (2006.01); B29C 59/04 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
G02B 5/0268 (2013.01); B22D 25/02 (2013.01); B29C 43/021 (2013.01); B29D 11/0074 (2013.01); C22C 21/00 (2013.01); C22C 21/06 (2013.01); C22F 1/00 (2013.01); C22F 1/04 (2013.01); C22F 1/047 (2013.01); C25D 11/08 (2013.01); C25D 11/12 (2013.01); C25D 11/16 (2013.01); C25D 11/24 (2013.01); G02B 1/118 (2013.01); B29C 59/046 (2013.01); B29L 2031/772 (2013.01); Y10T 428/24355 (2015.01);
Abstract

A prototype aluminum mold for stampers that is used to manufacture stampers having a fine irregular surface structure on the surface thereof and containing aluminum and magnesium, wherein the content of magnesium is 0.1% by mass to 3% by mass, the content of silicon is 100 ppm by mass or less, the total content of elements other than aluminum and magnesium is 500 ppm by mass or less, and the number of magnesium silicide particles having an equivalent diameter of 10 nm or more on the surface of the prototype aluminum mold for stampers is 10/1000 μmor less.


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