The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Jan. 17, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Sung-Yong Park, Suwon-si, KR;

Sang-Boo Kang, Hwaseong-si, KR;

Jae-Geun Kim, Seoul, KR;

Sung-Hyup Kim, Hwaseong-si, KR;

Jeong-Min Na, Seoul, KR;

Jae-Hyoung Park, Yongin-si, KR;

Sang-Kyu Yoo, Hwaseong-si, KR;

Jae-Hoon Joo, Seongnam-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/073 (2006.01); G01R 1/04 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07342 (2013.01); G01R 1/04 (2013.01); G01R 31/2889 (2013.01);
Abstract

An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.


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