The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Sep. 12, 2016
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventor:

Tasuku Nakayama, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 11/14 (2006.01); G01B 11/16 (2006.01); G01L 1/24 (2006.01); B32B 7/12 (2006.01); B32B 25/08 (2006.01); B32B 27/08 (2006.01); B32B 27/18 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 27/40 (2006.01); G06C 1/00 (2006.01); B32B 7/03 (2019.01);
U.S. Cl.
CPC ...
G01B 11/165 (2013.01); B32B 7/03 (2019.01); B32B 7/12 (2013.01); B32B 25/08 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/30 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); G01L 1/24 (2013.01); G06C 1/00 (2013.01); B32B 2250/03 (2013.01); B32B 2250/24 (2013.01); B32B 2270/00 (2013.01); B32B 2307/4023 (2013.01); B32B 2307/412 (2013.01); B32B 2307/51 (2013.01); B32B 2307/54 (2013.01); B32B 2307/712 (2013.01); B32B 2307/732 (2013.01); B32B 2307/734 (2013.01); B32B 2419/00 (2013.01); B32B 2607/00 (2013.01);
Abstract

At least one aspect of the present disclosure directs to a deformation amount measuring method is a method in which a sheet () is used that includes a first layer portion () having a first pattern () that includes a plurality of line drawings extending in a first direction, and a second layer portion () overlaid on the first layer portion () and having a second pattern () that includes a plurality of line drawings extending in a second direction different than the first direction. The method includes the steps of acquiring, from the sheet () that has been disposed on a measurement subject, post-deformation image data corresponding to a post-deformation image including a post-deformation moire produced as a result of a post-deformation first pattern () and second pattern () being overlaid and finding an amount of deformation of the measurement subject on the basis of the post-deformation image data.


Find Patent Forward Citations

Nakayama, Tasuku. (2019). Deformation amount measuring method, program, server device, and system (U.S. Patent No. 10295332). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10295332

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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