The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
Jan. 22, 2018
Applicant:
Lg Electronics Inc., Seoul, KR;
Inventors:
Changhwan Lee, Seoul, KR;
Jinwon Kang, Seoul, KR;
Hangtae Kim, Seoul, KR;
Yunsup Shin, Seoul, KR;
Minyoung Lee, Seoul, KR;
Ayoung Cho, Seoul, KR;
Assignee:
LG ELECTRONICS INC., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 19/00 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); F21V 29/70 (2015.01); F21K 9/69 (2016.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 33/48 (2010.01); H01L 33/58 (2010.01); F21Y 115/10 (2016.01); H04N 13/254 (2018.01);
U.S. Cl.
CPC ...
F21V 19/0025 (2013.01); F21K 9/69 (2016.08); F21V 29/70 (2015.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); F21Y 2115/10 (2016.08); H01L 33/486 (2013.01); H01L 33/58 (2013.01); H01L 2224/48091 (2013.01); H04N 13/254 (2018.05); H05K 2201/10106 (2013.01);
Abstract
A lighting device includes a printed circuit board (PCB), a submount mounted on the PCB, a die mounted on the submount and including a plurality of light emitting devices, and a pad inserted into a hole formed in the submount such that the die and the PCB are electrically connected through the submount, connected to the die by a wire bonding, and electrically connected to the PCB.