The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Oct. 21, 2014
Applicant:

United Technologies Corporation, Hartord, CT (US);

Inventors:

David R. Lyders, Middletown, CT (US);

Marc E. Holyfiield, Cromwell, CT (US);

Kevin M. Bell, Higganum, CT (US);

Assignee:

UNITED TECHNOLOGIES CORPORATION, Farmington, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F01D 25/02 (2006.01); H05B 3/00 (2006.01); F02C 7/047 (2006.01); B29C 70/48 (2006.01); B29C 70/88 (2006.01); F02K 3/02 (2006.01); H05B 3/42 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
F01D 25/02 (2013.01); B29C 70/48 (2013.01); B29C 70/882 (2013.01); F02C 7/047 (2013.01); F02K 3/02 (2013.01); H05B 3/0014 (2013.01); H05B 3/42 (2013.01); H05K 1/0212 (2013.01); H05K 1/0296 (2013.01); H05K 3/0014 (2013.01); F05D 2220/36 (2013.01); F05D 2260/20 (2013.01); F05D 2300/40 (2013.01); F05D 2300/603 (2013.01); Y02T 50/672 (2013.01);
Abstract

A method of forming a circuit in a composite component includes providing a plurality of preform modules comprised of an organic matrix composite material, applying at least one electrical circuit on at least first and second preform modules of the plurality of preform modules, and arranging the first and second preform modules such that the electrical circuit of the first preform module is in contact with the electrical circuit of the second preform module. An additional step includes molding the first and second preform modules together to form a one-piece molded component such that the electrical circuits of the first and second preform modules form a complete circuit.


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