The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Dec. 22, 2015
Applicant:

Sumitomo Chemical Company, Limited, Tokyo, JP;

Inventors:

Hajime Fujikura, Hitachi, JP;

Taichiro Konno, Hitachi, JP;

Takayuki Numata, Hitachi, JP;

Shusei Nemoto, Hitachi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/68 (2006.01); C23C 16/00 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); C23C 16/34 (2006.01); C23C 16/52 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); C23C 16/30 (2006.01);
U.S. Cl.
CPC ...
C23C 16/458 (2013.01); C23C 16/303 (2013.01); C23C 16/34 (2013.01); C23C 16/4586 (2013.01); C23C 16/46 (2013.01); C23C 16/52 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02658 (2013.01); H01L 21/02664 (2013.01); H01L 21/6776 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); H01L 21/67778 (2013.01);
Abstract

There is provided a substrate processing apparatus, comprising: a substrate placing table which is provided to at least one of the temperature elevating part and the temperature lowering part formed in a container, and which causes heat-transfer to occur with the substrate placed on a placing surface; and a temperature control part which controls a temperature of the substrate placing table, wherein the temperature control part is configured to: control the temperature of the substrate placing table so that the temperature of the substrate to be loaded into the processing part is elevated to a predetermined temperature, before the substrate is placed on the substrate placing table, when the substrate placing table is provided to the temperature elevating part; and control the temperature of the substrate placing table so that the temperature of the processed substrate unloaded from the processing part is lowered to a predetermined temperature, before the substrate is placed on the substrate placing table, when the substrate placing table is provided to the temperature lowering part.


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