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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10294395 B1

PDFFull Text
Date of Patent:
May. 21, 2019

Filed:

Dec. 01, 2015

Adhesive composition, semiconductor device containing cured product thereof, and method for manufacturing semiconductor device using same

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Kazuyuki Matsumura, Otsu, JP;

Koichi Fujimaru, Otsu, JP;

Daisuke Kanamori, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

RatnerPrestia

Primary Examiner:

Asok K Sarkar

Int. Cl.
CPC ...
C09J 11/04 (2006.01); C09J 171/12 (2006.01); C09J 11/06 (2006.01); C09J 163/00 (2006.01); C09J 201/00 (2006.01); C09J 193/04 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 163/00 (2013.01); C09J 171/12 (2013.01); C09J 193/04 (2013.01); C09J 201/00 (2013.01); H01L 23/544 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/16501 (2013.01); H01L 2224/8113 (2013.01); H01L 2224/81855 (2013.01); H01L 2924/3512 (2013.01);
Abstract

The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.

Find Patent Forward Citations

Matsumura, Kazuyuki. (2019). Adhesive composition, semiconductor device containing cured product thereof, and method for manufacturing semiconductor device using same (U.S. Patent No. 10294395). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10294395

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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