The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
Dec. 15, 2017
Hyundai Motor Company, Seoul, KR;
Kia Motors Corporation, Seoul, KR;
Lg Hausys, Ltd., Seoul, KR;
Hyundai Ep Co., Ltd., Dangjin-si, Chungcheongnam-do, KR;
Hyun Gyung Kim, Hwaseong-si, KR;
Hee Joon Lee, Seoul, KR;
Eun Seob Shin, Yongin-si, KR;
Hyeok Lee, Suwon-si, KR;
Ki Hyun Sung, Ulsan, KR;
Chun Ho Park, Cheongju-si, KR;
Hyundai Motor Company, Seoul, KR;
Kia Motors Corporation, Seoul, KR;
LG Hausys, Ltd., Seoul, KR;
Hyundai EP Co., Ltd., Seoul, KR;
Abstract
A polypropylene resin composition includes a base resin, a thermoplastic elastomer, and an inorganic filler. The base resin is a polypropylene-based mixed resin including a first resin, a second resin, a third resin, and a fourth resin. The first resin is a homopolypropylene resin. The second resin, the third resin, and the fourth resin are each a polypropylene-based block copolymer resin. A melt index of the second resin measured at a temperature of 230° C. and under a load of 2.16 kg is higher than a melt index of each of the third resin and the fourth resin measured under the same condition. A flexural modulus of the third resin measured in accordance with ASTM D790 is lower than a flexural modulus of the fourth resin measured under the same condition.