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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10294341 B1

PDFFull Text
Date of Patent:
May. 21, 2019

Filed:

Dec. 28, 2016

Thermosetting resin composition for semiconductor package and prepreg using the same

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Hwa Yeon Moon, Daejeon, KR;

Yong Seon Hwang, Daejeon, KR;

Hee Yong Shim, Daejeon, KR;

Hyun Sung Min, Daejeon, KR;

Mi Seon Kim, Daejeon, KR;

Chang Bo Shim, Daejeon, KR;

Young Chan Kim, Daejeon, KR;

Seung Hyun Song, Daejeon, KR;

Won Ki Kim, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:

Dentons US LLP

Primary Examiner:

Hannah J Pak

Int. Cl.
CPC ...
C08K 9/06 (2006.01); C08J 5/24 (2006.01); C08L 33/08 (2006.01); C08L 33/24 (2006.01); C08L 63/00 (2006.01); H01L 23/29 (2006.01); C08L 65/02 (2006.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01); C08L 61/14 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); C08K 9/06 (2013.01); C08L 33/08 (2013.01); C08L 33/24 (2013.01); C08L 61/14 (2013.01); C08L 63/00 (2013.01); C08L 65/02 (2013.01); H01L 23/145 (2013.01); H01L 23/29 (2013.01); H01L 23/562 (2013.01); C08G 2261/135 (2013.01); C08G 2261/142 (2013.01); C08G 2261/143 (2013.01); C08G 2261/1414 (2013.01); C08G 2261/3424 (2013.01); C08G 2261/76 (2013.01); C08J 2365/02 (2013.01); C08J 2433/00 (2013.01); C08J 2463/00 (2013.01); C08J 2479/08 (2013.01); H01L 23/3735 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01);
Abstract

The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.

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