The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Feb. 02, 2017
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventors:

Yoshimichi Yamao, Toyota, JP;

Masayoshi Ogawa, Toyota, JP;

Masanobu Suzuki, Okazaki, JP;

Assignee:

YAZAKI CORPORATION, Minato-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02G 3/04 (2006.01); B60R 16/02 (2006.01);
U.S. Cl.
CPC ...
B60R 16/0215 (2013.01);
Abstract

A resin molded body () includes a metal attachment member () and an extension part () extending from the resin molded body. At least one part of the metal attachment member () is exposed in a mounting surface () of the resin molded body. The mounting surface () is to be facing to the mounting target when the resin molded body is fixed to a mounting target. At least one part of the extension part () is protruded outside the mounting surface. A protrusion length of the at least one part of the extension part () from the mounting surface is larger than a protrusion length of the metal attachment member () from the mounting surface. The at least one part is configured to allow deforming in a direction away from the mounting target when the resin molded body is fixed to the mounting target.


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