The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Sep. 13, 2017
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventors:

Masakuni Samejima, Shizuoka, JP;

Takeo Koga, Shizuoka, JP;

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/30 (2006.01); B32B 27/06 (2006.01); H01F 5/04 (2006.01); H01R 13/50 (2006.01); H05K 5/00 (2006.01); H02G 3/16 (2006.01);
U.S. Cl.
CPC ...
B32B 3/30 (2013.01); B32B 27/06 (2013.01); H01F 5/04 (2013.01); H01R 13/50 (2013.01); H05K 5/003 (2013.01); H05K 5/0034 (2013.01); H05K 5/0069 (2013.01); B32B 2457/00 (2013.01); H02G 3/16 (2013.01); Y10T 428/24008 (2015.01);
Abstract

A resin molded body includes a connector unit having a side wall and an inner wall, both of which define a fitting chamber to which a mating connector is fitted and having a terminal penetrating through the inner wall and extending in a fitting direction, a substrate accommodating unit accommodating a circuit substrate to which the terminal is connected, and a device accommodating unit accommodating a device connected to the circuit substrate. The resin molded body is an integral molded product made of resin. A connecting portion has a plate shape extending outwards from the inner wall of the connector unit, and a second thickness thinner than a first thickness of the inner wall. The connecting portion is linked to the device accommodating unit.


Find Patent Forward Citations

Loading…