The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Jun. 07, 2016
Applicant:

Xerox Corporation, Norwalk, CT (US);

Inventors:

Robert A. Clark, Williamson, NY (US);

Michael F. Zona, Webster, NY (US);

William J. Nowak, Webster, NY (US);

Chu-heng Liu, Penfield, NY (US);

Jorge A. Alvarez, Webster, NY (US);

Paul J. McConville, Webster, NY (US);

Assignee:

Xerox Corporation, Norwalk, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/188 (2017.01); B29C 64/393 (2017.01); B29C 64/141 (2017.01); B29C 64/40 (2017.01); G05B 19/4099 (2006.01); G03G 15/16 (2006.01); G03G 15/22 (2006.01); B33Y 10/00 (2015.01); B29C 64/106 (2017.01); B29C 64/20 (2017.01); B29C 64/214 (2017.01); B33Y 30/00 (2015.01); B33Y 40/00 (2015.01); B33Y 50/02 (2015.01); B29K 105/00 (2006.01); B29C 64/223 (2017.01);
U.S. Cl.
CPC ...
B29C 64/188 (2017.08); B29C 64/106 (2017.08); B29C 64/141 (2017.08); B29C 64/20 (2017.08); B29C 64/214 (2017.08); B29C 64/393 (2017.08); B29C 64/40 (2017.08); B33Y 10/00 (2014.12); G03G 15/1605 (2013.01); G03G 15/224 (2013.01); G05B 19/4099 (2013.01); B29C 64/223 (2017.08); B29K 2105/251 (2013.01); B29K 2995/001 (2013.01); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); G05B 2219/35134 (2013.01); G05B 2219/49007 (2013.01);
Abstract

A three-dimensional (3-D) printer includes build and support material development stations positioned to transfer layers of build and support materials to an intermediate transfer surface. The intermediate transfer surface transfers a layer of the build and support materials to a platen each time the platen contacts the intermediate transfer surface. A sensor detects the thickness of the layer on the platen, and a mechanical planer is positioned to contact and level the layer on the platen as the platen moves past the mechanical planer. Additionally, a feedback loop is electrically connected to the sensor and the mechanical planer. The mechanical planer adjusts the amount of the build material and the support material removed from the layer based on the thickness of the layer on the platen, as determined by the sensor.


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