The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Nov. 07, 2014
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Sasha Marjanovic, Painted Post, NY (US);

Garrett Andrew Piech, Corning, NY (US);

Shyamala Shanmugam, Painted Post, NY (US);

Sergio Tsuda, Horseheads, NY (US);

Robert Stephen Wagner, Corning, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/04 (2014.01); B23K 26/06 (2014.01); B23K 26/38 (2014.01); B23K 26/53 (2014.01); B23K 26/55 (2014.01); B32B 17/06 (2006.01); C03B 33/02 (2006.01); C03B 33/09 (2006.01); C03C 15/00 (2006.01); C03C 17/00 (2006.01); B23K 26/384 (2014.01); B23K 26/402 (2014.01); B23K 26/0622 (2014.01); C09K 13/00 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/384 (2015.10); B23K 26/04 (2013.01); B23K 26/0613 (2013.01); B23K 26/0617 (2013.01); B23K 26/0624 (2015.10); B23K 26/38 (2013.01); B23K 26/402 (2013.01); B23K 26/53 (2015.10); B32B 17/064 (2013.01); C03B 33/0222 (2013.01); C03B 33/091 (2013.01); C03C 15/00 (2013.01); C03C 17/00 (2013.01); B23K 26/55 (2015.10); B23K 2103/50 (2018.08); C03C 2217/70 (2013.01); C09K 13/00 (2013.01); Y02P 40/57 (2015.11); Y10T 428/24273 (2015.01); Y10T 428/24322 (2015.01);
Abstract

Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.


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