The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Aug. 28, 2012
Applicants:

Hiroto Watanabe, Tokyo, JP;

Hiroaki Imai, Yokohama, JP;

Yuya Oaki, Yokohama, JP;

Inventors:

Hiroto Watanabe, Tokyo, JP;

Hiroaki Imai, Yokohama, JP;

Yuya Oaki, Yokohama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01J 8/00 (2006.01); B01J 35/00 (2006.01); C09C 1/30 (2006.01); B01J 21/08 (2006.01); B01J 21/18 (2006.01); B01J 23/22 (2006.01); B01J 23/26 (2006.01); B01J 23/30 (2006.01); B01J 23/34 (2006.01); B01J 23/50 (2006.01); B01J 23/52 (2006.01); B01J 23/72 (2006.01); B01J 23/74 (2006.01); B01J 23/75 (2006.01); B01J 35/10 (2006.01); B01J 37/00 (2006.01); B01J 37/02 (2006.01); B01J 37/03 (2006.01); B01J 37/08 (2006.01); C01B 33/18 (2006.01); C01B 33/12 (2006.01); B01J 23/745 (2006.01); B01J 23/755 (2006.01); B82Y 30/00 (2011.01); C01B 32/05 (2017.01); B01J 37/12 (2006.01); B01J 37/34 (2006.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
B01J 8/008 (2013.01); B01J 21/08 (2013.01); B01J 21/18 (2013.01); B01J 23/22 (2013.01); B01J 23/26 (2013.01); B01J 23/30 (2013.01); B01J 23/34 (2013.01); B01J 23/50 (2013.01); B01J 23/52 (2013.01); B01J 23/72 (2013.01); B01J 23/74 (2013.01); B01J 23/745 (2013.01); B01J 23/75 (2013.01); B01J 23/755 (2013.01); B01J 35/002 (2013.01); B01J 35/004 (2013.01); B01J 35/1023 (2013.01); B01J 35/1028 (2013.01); B01J 35/1038 (2013.01); B01J 35/1042 (2013.01); B01J 35/1057 (2013.01); B01J 35/1061 (2013.01); B01J 35/1085 (2013.01); B01J 37/0018 (2013.01); B01J 37/0201 (2013.01); B01J 37/033 (2013.01); B01J 37/08 (2013.01); B82Y 30/00 (2013.01); C01B 32/05 (2017.08); C01B 33/124 (2013.01); C01B 33/18 (2013.01); C09C 1/3045 (2013.01); B01J 37/12 (2013.01); B01J 37/346 (2013.01); B01J 2208/00805 (2013.01); B01J 2208/00946 (2013.01); B82Y 40/00 (2013.01); C01P 2004/51 (2013.01); C01P 2004/52 (2013.01); C01P 2004/64 (2013.01); C01P 2006/42 (2013.01); Y10S 977/776 (2013.01); Y10S 977/777 (2013.01); Y10T 428/268 (2015.01); Y10T 428/2982 (2015.01);
Abstract

Provided is a process for producing satisfactory particles held in porous silica. The process comprises (a) the step of preparing porous silica, (b) the step of bringing the porous silica into contact with a liquid which contains either a metal or a compound that has the metal as a component element and infiltrating the liquid into the pores of the porous silica, and (c) the step of subjecting, after the step (b), the impregnated porous silica to a heat treatment to thereby form fine particles comprising the metal or the metal compound in the pores of the porous silica. When porous silica is synthesized by hydrolyzing an alkoxysilane in a solvent-free system, it is possible to synthesize porous silica having a fine pore diameter. Use of this porous silica as a template facilitates formation of particles (e.g., W, Cu, Cr, Mn, Fe, Co, or Ni or an oxide of any of these metals) that show peculiar properties not observed in the bulk material.


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