The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Apr. 04, 2017
Applicant:

Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;

Inventors:

Robert Dittmer, Hanau, DE;

Senthil Kumar Balasubramanian, Singapore, SG;

Leoni Wilhelm, Ober Ramstadt, DE;

Thomas Schmitt, Krombach, DE;

Thorsten Kaiser, Ortenberg, DE;

Tim Asmus, Allendorf-Winnen, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); A61N 1/375 (2006.01); A61B 5/00 (2006.01); B23K 11/00 (2006.01); B23K 20/00 (2006.01); B23K 20/10 (2006.01); B23K 26/22 (2006.01); H01B 1/02 (2006.01); H05K 5/00 (2006.01); B23K 26/32 (2014.01); H01R 43/02 (2006.01); B23K 101/42 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3754 (2013.01); A61B 5/686 (2013.01); B23K 11/002 (2013.01); B23K 20/004 (2013.01); B23K 20/106 (2013.01); B23K 26/22 (2013.01); B23K 26/32 (2013.01); H01B 1/02 (2013.01); H01R 43/0207 (2013.01); H05K 5/0091 (2013.01); H05K 5/0247 (2013.01); B23K 2101/42 (2018.08); B23K 2103/16 (2018.08); H01R 43/0214 (2013.01); H01R 43/0221 (2013.01); H01R 2201/12 (2013.01);
Abstract

One aspect relates to a feedthrough system. The feedthrough system includes a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one area forming an electrically conductive cermet pathway. The cermet pathway may include an electrically conductive metal. The wire may be at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.


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