The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Apr. 02, 2018
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Jung-Sik Park, Gyeonggi-do, KR;

Seung-Ki Choi, Gyeonggi-do, KR;

Joon Heo, Gyeonggi-do, KR;

Hyun-Ju Hong, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 9/00 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/002 (2013.01); H05K 1/0218 (2013.01); H05K 5/0004 (2013.01); H05K 5/0017 (2013.01); H05K 9/0024 (2013.01); H05K 9/0039 (2013.01); H01L 2224/16225 (2013.01); H05K 1/0259 (2013.01); H05K 2201/0919 (2013.01); H05K 2201/09354 (2013.01); H05K 2201/10371 (2013.01);
Abstract

An electronic device is provided that includes a PCB including a first surface, a second surface, and a side surface; an electronic component arranged on the first surface, adjacent to a portion of the side surface; a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB, wherein the sidewall extends in a first direction that is non-parallel to the first surface of the PCB; a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure. The sidewall contacts with the first surface of the PCB and overlaps with the second conductive structure, when viewed from above the first surface of the PCB.


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