The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Aug. 21, 2017
Applicant:
Seagate Technology Llc, Cupertino, CA (US);
Inventors:
Thomas Lee Schick, Arvada, CO (US);
Robert Matousek, Berthoud, CO (US);
Sunil Anuprasad Patel, Longmont, CO (US);
Assignee:
SEAGATE TECHNOLOGY LLC, Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 33/12 (2006.01); H05K 3/34 (2006.01); G11B 5/48 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3442 (2013.01); G11B 5/486 (2013.01); G11B 5/4846 (2013.01); G11B 33/12 (2013.01); G11B 33/122 (2013.01); H05K 1/0231 (2013.01); H05K 1/162 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 2201/10636 (2013.01);
Abstract
A compact printed circuit board assembly includes a printed circuit board (PCB) and a preamplifier subassembly. The preamplifier subassembly includes a preamplifier and an insulating endcap abutting one another and arranged in a plane parallel to the PCB. An electrical via formed within the first insulating endcap provides an electrical connection between a decoupling capacitor and the PCB to reduce noise detectable in current flowing between the preamplifier and a current source.