The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Aug. 09, 2013
Smartrac Technology Gmbh, Dresden, DE;
Carsten Nieland, Gotha, DE;
Frank Kriebel, Lichtenberg, DE;
SMARTRAC TECHNOLOGY GMBH, Dresden, DE;
Abstract
The invention relates to a contact bump connection () and to a method for producing a contact bump connection between an electronic component being provided with at least one terminal face () and a contact substrate () being contacted with the component and having at least one second terminal face (), wherein the first terminal face is provided with a contact bump (), which has a raised edge () and has at least one displacement pin () in a displacement compartment () being surrounded by the raised edge and being open towards a head end of the contact bump, and wherein, in a contact region () with the first terminal face, the second terminal face has a contact bead (), which is formed by displacement of a contact material () of the second terminal face into the displacement compartment and which surrounds the displacement pin, said contact bead having a bead crown () which is oriented to a bottom () of the displacement compartment and is raised relative to a level contact surface () of the second terminal face surrounding the contact region.