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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10292264 B1

PDFFull Text
Date of Patent:
May. 14, 2019

Filed:

Apr. 12, 2018

Insulating ceramic paste, ceramic electronic component, and method for producing the same

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Sumiyo Nakamura, Kyoto, JP;

Takahiro Sumi, Kyoto, JP;

Takahiro Oka, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Steven T Sawyer

Int. Cl.
CPC ...
H05K 1/03 (2006.01); C04B 35/195 (2006.01); H01L 23/12 (2006.01); H01L 23/15 (2006.01); H01L 21/48 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); C04B 35/20 (2006.01); H05K 1/02 (2006.01); H05K 3/12 (2006.01); C04B 35/622 (2006.01); C04B 35/626 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); C04B 35/195 (2013.01); C04B 35/20 (2013.01); C04B 35/62218 (2013.01); C04B 35/62625 (2013.01); H01L 21/4867 (2013.01); H01L 23/12 (2013.01); H01L 23/15 (2013.01); H05K 1/0298 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 3/1291 (2013.01); H05K 3/4629 (2013.01); C04B 2235/3215 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3481 (2013.01); C04B 2235/36 (2013.01); C04B 2235/80 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 2924/0002 (2013.01); H05K 2201/017 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/068 (2013.01); H05K 2201/099 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/09909 (2013.01); Y02P 70/611 (2015.11);
Abstract

Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

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