The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

May. 07, 2015
Applicants:

The Board of Trustees of the University of Illinois, Urbana, IL (US);

Northwestern University, Evanston, IL (US);

Inventors:

John A Rogers, Champaign, IL (US);

Yonggang Huang, Glencoe, IL (US);

Heung Cho Ko, Urbana, IL (US);

Mark Stoykovich, Dover, NH (US);

Won Mook Choi, Champaign, IL (US);

Jizhou Song, Evanston, IL (US);

Jong Hyun Ahn, Gyeonggi-do, KR;

Dae Hyeong Kim, Champaign, IL (US);

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H05K 3/20 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01); H05K 1/11 (2006.01); B33Y 80/00 (2015.01); H01L 25/065 (2006.01); H01L 27/146 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H01L 21/4867 (2013.01); H01L 21/6835 (2013.01); H01L 23/4985 (2013.01); H01L 25/50 (2013.01); H05K 1/0283 (2013.01); H05K 1/03 (2013.01); H05K 1/111 (2013.01); H05K 1/118 (2013.01); H05K 1/185 (2013.01); H05K 3/207 (2013.01); H05K 3/284 (2013.01); H05K 3/30 (2013.01); B33Y 80/00 (2014.12); H01L 25/0655 (2013.01); H01L 27/14601 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/05624 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/3025 (2013.01); H05K 1/036 (2013.01); H05K 1/0393 (2013.01); H05K 1/16 (2013.01); H05K 2201/0133 (2013.01); H05K 2203/0271 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/4913 (2015.01); Y10T 29/49146 (2015.01);
Abstract

Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.


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