The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Jan. 06, 2015
Applicant:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); H05K 1/02 (2006.01); B32B 15/08 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01); H05K 3/02 (2006.01); C08J 5/04 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); B32B 15/08 (2013.01); C08J 5/043 (2013.01); C08J 5/24 (2013.01); H05K 1/0298 (2013.01); H05K 1/0393 (2013.01); H05K 3/022 (2013.01); H05K 3/4644 (2013.01); C08J 2379/08 (2013.01); C08J 2465/00 (2013.01); C08J 2479/04 (2013.01); H05K 1/036 (2013.01); H05K 1/0366 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/09136 (2013.01);
Abstract
The present invention provides an insulating layer for printed circuit boards having a difference of within 20% between the flexural modulus at 25° C. and the flexural modulus under heat at 250° C.