The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Mar. 27, 2018
Applicant:
Saint-gobain Glass France, Courbevoie, FR;
Inventors:
Klaus Schmalbuch, Goult, DE;
Bernhard Reul, Herzogenrath, DE;
Mitja Rateiczak, Wuerselen, DE;
Lothar Lesmeister, Landgraaf, NL;
Assignee:
SAINT-GOBAIN GLASS FRANCE, Courbevoie, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/02 (2006.01); H01R 12/53 (2011.01); H01R 12/57 (2011.01); B23K 1/00 (2006.01); B23K 31/02 (2006.01); H01Q 1/12 (2006.01); H01R 43/02 (2006.01); H01R 43/048 (2006.01); H05B 3/84 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H01R 4/02 (2006.01); H01R 4/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0212 (2013.01); B23K 1/0016 (2013.01); B23K 31/02 (2013.01); H01Q 1/1271 (2013.01); H01R 12/53 (2013.01); H01R 12/57 (2013.01); H01R 43/0235 (2013.01); H01R 43/048 (2013.01); H05B 3/84 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); H01R 4/02 (2013.01); H01R 4/184 (2013.01); H01R 2201/02 (2013.01); H01R 2201/26 (2013.01); H05B 2203/016 (2013.01); H05K 2201/068 (2013.01);
Abstract
A pane having an electrical connection element, the pane having: a substrate; an electrically conductive structure in a region of the substrate; and a connection element in a region of the electrically conductive structure, the connection element containing at least a chromium-containing steel. The connection element has a region which is crimped about a connecting cable and a soldering region connected-to the electrically conductive structure by means of a lead-free solder.