The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Nov. 24, 2014
Applicant:
Tesat-spacecom Gmbh & Co. KG, Backnang, DE;
Inventors:
Hanspeter Katz, Stuttgart, DE;
Jochen Artmann, Weissach im Tal, DE;
Eric Wolf, Waiblingen, DE;
Christian Rapp, Backnang, DE;
Ulrich Koeger, Gaildorf, DE;
Assignee:
Tesat-Spacecom GmbH & Co. KG, Backnang, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H05K 1/0207 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 2201/10416 (2013.01);
Abstract
A circuit board includes a plurality of conductive track levels disposed one above the other and insulation layers arranged between each of two adjacent conductive track levels. The circuit board includes a thermally conductive element, which includes ceramic, disposed between a first external insulation layer and a second external insulation layer.