The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Oct. 17, 2014
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Xiaoqing Li, Wuhan, CN;

Jinjing Jiang, Shenzhen, CN;

Zhiguo Zhang, Wuhan, CN;

Bin Wang, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); C09J 9/02 (2006.01); H01L 23/367 (2006.01); H05K 9/00 (2006.01); H01L 23/36 (2006.01); H01L 23/42 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); C09J 9/02 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H01L 23/42 (2013.01); H01L 23/552 (2013.01); H05K 1/0209 (2013.01); H05K 1/0212 (2013.01); H05K 9/0009 (2013.01); H05K 9/0032 (2013.01); C09J 2201/128 (2013.01); C09J 2201/602 (2013.01); C09J 2203/326 (2013.01); H01L 2924/0002 (2013.01); H05K 2201/066 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/10371 (2013.01);
Abstract

A heat-dissipation and shielding structure, including a shielding case, a thermal pad, and a heat sink. The bottom of the shielding case is connected to a circuit board used to carry a heat emitting element, the heat sink is disposed on the top of the shielding case, the top of the shielding case is provided with an opening, the thermal pad runs through the opening, a bottom surface of the thermal pad is attached to the heat emitting element, and a top surface of the thermal pad is attached to the heat sink; and the heat-dissipation and shielding structure further includes a metal spring plate, where the metal spring plate is located on a periphery of the opening and encircles the opening, and the metal spring plate is elastically connected between the shielding case and the heat sink.


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