The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Nov. 17, 2017
Applicant:

Guangdong Oppo Mobile Telecommunications Corp., Ltd., Dongguan, CN;

Inventors:

Yi Wei, Dongguan, CN;

Yong Li, Dongguan, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2258 (2013.01); H04M 1/0264 (2013.01); H04N 5/2252 (2013.01); H04N 5/2257 (2013.01); H05K 1/028 (2013.01); H05K 1/14 (2013.01); H05K 1/189 (2013.01); H04M 1/0277 (2013.01); H05K 2201/10121 (2013.01);
Abstract

A dual-camera module assembly includes a first flexible printed circuit (FPC), a second FPC, a first camera module and a second camera module. The first FPC includes a first body and a first connecting end, the first body being connected to the first camera module. The second FPC includes a second body, and an extension portion and a second connecting end sequentially extending from the second body, the second body being connected to the second camera module, the extension portion and the first body are arranged in a superposition manner. The first connecting end and the second connecting end are connected to a main circuit board. A smallest one of distances from the first connecting end to an antenna clearance zone of the main circuit board and distances from the second connecting end to the antenna clearance zone is greater than or equal to a predetermined value.


Find Patent Forward Citations

Loading…