The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10291447 B1

PDF
Full Text
Expired
Date of Patent:
May. 14, 2019

Filed:

Jun. 01, 2016
Applicants:

Logomotion, S.r.o., Piestany, SK;

Smk-logomotion Corporation, Tokyo, JP;

Inventor:

Miroslav Florek, Bratislava, SK;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 5/00 (2006.01); H04L 27/06 (2006.01); E04H 15/20 (2006.01);
U.S. Cl.
CPC ...
H04L 27/06 (2013.01); E04H 15/20 (2013.01); H04B 5/0025 (2013.01); E04H 2015/201 (2013.01);
Abstract

During the contactless transfer of the data from PICC () to PCD () with the load modulation within PICC () the analog signal between the transmitting antenna () and the output of the driver () is demodulated. From the demodulated output the digital data are generated for the direction of the subsequent modification of the signal led to the PICC () antenna set. The digital data gather from the demodulated signal are used for the amplification and/or attenuation of the signal received on the side of the PCD () and/or for synchronization or other modification of the signal on the side of the PICC (), whereby no further modification of the driver () is needed. The connection on the LA, LB outputs appears to the driver () by its characteristics, mainly by its impedance, in the same way as the connected antenna () of the original connection according to the prior state of the art. Such processing and connection allows to use broadly available analog drivers () which can be combined with various other elements of other producers, which achieves real compatibility and high amount of freedom when designing the circuits, as well as the independence from the particular producer of the chips.


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