The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Dec. 23, 2014
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventor:

Yohei Shimizu, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/08 (2006.01); B26F 3/16 (2006.01); H03H 9/25 (2006.01); B26F 3/00 (2006.01); B23K 26/53 (2014.01); H03H 3/02 (2006.01); B23K 26/57 (2014.01); H03H 9/02 (2006.01); H01L 21/82 (2006.01); H01L 21/78 (2006.01); H01L 27/01 (2006.01); H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
H03H 3/08 (2013.01); B23K 26/53 (2015.10); B23K 26/57 (2015.10); B26F 3/002 (2013.01); B26F 3/16 (2013.01); H03H 3/02 (2013.01); H03H 9/02133 (2013.01); H03H 9/25 (2013.01); H01L 21/78 (2013.01); H01L 21/82 (2013.01); H01L 27/01 (2013.01); H01L 27/016 (2013.01); H01L 27/0805 (2013.01); Y10T 29/42 (2015.01); Y10T 225/12 (2015.04);
Abstract

A method for manufacturing an acoustic wave device includes: forming an altered domain in a supporting substrate by irradiating the supporting substrate with a laser light, a piezoelectric substrate being joined to an upper surface of the supporting substrate; forming a groove on an upper surface of the piezoelectric substrate so as to overlap with the altered domain; and cutting the supporting substrate at the groove.


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