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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10291148 B1

PDFFull Text
Date of Patent:
May. 14, 2019

Filed:

Jul. 19, 2013

Power conversion apparatus

Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Masashi Kosuga, Hitachinaka, JP;

Hideyo Suzuki, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Bickey Dhakal

Assistant Examiner:

Cortez M Cook

Int. Cl.
CPC ...
H02M 7/00 (2006.01); H05K 7/14 (2006.01); H02M 7/537 (2006.01); B60L 3/00 (2019.01); B60L 3/04 (2006.01); B60L 11/12 (2006.01); B60L 11/14 (2006.01); B60L 15/00 (2006.01); H02P 6/14 (2016.01);
U.S. Cl.
CPC ...
H02M 7/537 (2013.01); B60L 3/0069 (2013.01); B60L 3/04 (2013.01); B60L 11/126 (2013.01); B60L 11/14 (2013.01); B60L 15/007 (2013.01); H02M 7/003 (2013.01); H02P 6/14 (2013.01); H05K 7/1432 (2013.01); B60L 2210/30 (2013.01); B60L 2210/40 (2013.01); B60L 2270/145 (2013.01); Y02T 10/6217 (2013.01); Y02T 10/645 (2013.01); Y02T 10/7077 (2013.01); Y02T 10/7241 (2013.01);
Abstract

An object of the present invention is to reduce the size of a power conversion apparatus and to improve the reliability. The power conversion apparatus includes a power semiconductor module, a driver circuit board mounted with a driver circuit, an AC-side relay conductor for transferring the alternating current, and an AC connector. The power semiconductor module includes an AC-side terminal connected to the AC-side relay conductor, and a control-side terminal connected to the driver circuit board. The AC connector is provided on the opposite side of the power semiconductor module through the driver circuit board. The driver circuit board includes a transformer for transforming voltage from low to high and supplying the transformed voltage to the driver circuit, and a line for connecting the transformer and the driver circuit. Further, the driver circuit board forms a through hold provided on the side opposite to the transformer with the driver circuit interposed therebetween. The AC-side relay conductor is connected to the AC-side connector, through the through hole.

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