The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Jan. 23, 2017
Applicant:

Computime, Ltd., Wanchai, HK;

Inventors:

Dick Kwai Chan, Hong Kong, HK;

Kam Wai Lam, Hong Kong, HK;

JZ Zheng, Shenzhen, CN;

Wai Yin Shum, Hong Kong, HK;

Brenton James Judge, Hong Kong, HK;

Hamza Yilmaz, Gilroy, CA (US);

Patrick Yeung, Hong Kong, HK;

Wai Ming Wu, Hong Kong, HK;

Assignee:

Computime, Ltd., New Territories, HK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/66 (2006.01); H02J 13/00 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); G01R 21/133 (2006.01); H01R 24/30 (2011.01); H01R 24/78 (2011.01); H01R 103/00 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H02J 13/0075 (2013.01); G01R 21/133 (2013.01); H01R 13/6658 (2013.01); H01R 24/30 (2013.01); H01R 24/78 (2013.01); H05K 1/0201 (2013.01); H05K 1/144 (2013.01); H01R 2103/00 (2013.01); H05K 1/0263 (2013.01); H05K 1/11 (2013.01); H05K 3/284 (2013.01); H05K 2201/10272 (2013.01); Y02B 70/3266 (2013.01); Y02B 90/226 (2013.01); Y02B 90/2653 (2013.01); Y04S 20/16 (2013.01); Y04S 20/242 (2013.01); Y04S 40/126 (2013.01);
Abstract

A smart plug that is partitioned into a plurality of printed circuit boards (PCBs) in a three dimensional manner to reduce its size. Aspects consider the effect of the possible increased internal temperature as the size of the smart plug is reduced. For example, thick metal foils connect various components of a smart plug to reduce heat dissipation within the smart plug. Also, a metal foil may transfer heat from contact metal on a PCB to a side wall of a plastic housing of the smart plug. The smart plug may comprise a computing device that obtains information identifying the attached electrical device and accesses device data about the time duration during which the attached electrical device exhibits transient characteristics. The computing device then uses the accessed data to effectively control the attached electrical device.


Find Patent Forward Citations

Loading…