The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Jun. 08, 2016
Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Yoshiyuki Kondo, Tokyo, JP;

Yuichi Otani, Tokyo, JP;

Yoshiteru Komuro, Tokyo, JP;

Atsushi Kodama, Tokyo, JP;

Koichi Hamamoto, Tokyo, JP;

Hiroyuki Daigo, Tokyo, JP;

Naoki Inoue, Tokyo, JP;

Tomoya Morioka, Tokyo, JP;

Masahiro Kato, Tokyo, JP;

Shingo Nishikata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/042 (2006.01); H01S 3/04 (2006.01); H01S 3/06 (2006.01); H01S 3/23 (2006.01); H01S 3/16 (2006.01); H01S 3/00 (2006.01); H01S 3/02 (2006.01);
U.S. Cl.
CPC ...
H01S 3/042 (2013.01); H01S 3/0407 (2013.01); H01S 3/0606 (2013.01); H01S 3/0612 (2013.01); H01S 3/005 (2013.01); H01S 3/025 (2013.01); H01S 3/0405 (2013.01); H01S 3/0604 (2013.01); H01S 3/0621 (2013.01); H01S 3/1611 (2013.01); H01S 3/1643 (2013.01); H01S 3/1685 (2013.01); H01S 3/2316 (2013.01);
Abstract

This solid laser amplification device has: a laser medium part that has a solid medium, into which a laser light enters from an entrance part and from which the laser light (L) is emitted to the outside from an exit part, and an amplification layer, which is provided on the surface of the medium, receives the laser light in the medium, and amplifies and reflects said light toward the exit part; a microchannel cooling part that cools the amplification layer; and a thermally conductive part that is provided so as to make contact between the amplification layer and the cooling part and transfers the heat of the amplification layer to the cooling part.


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