The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

May. 14, 2018
Applicant:

Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;

Inventors:

Fangyue Zhu, Shanghai, CN;

Haomai Yin, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/52 (2006.01); H01R 12/70 (2011.01); H01R 12/71 (2011.01); H01R 13/11 (2006.01); H01R 13/422 (2006.01); H01R 13/74 (2006.01); H05K 5/00 (2006.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01); B60L 53/16 (2019.01);
U.S. Cl.
CPC ...
H01R 13/5227 (2013.01); B60L 53/16 (2019.02); H01R 12/7047 (2013.01); H01R 12/716 (2013.01); H01R 13/111 (2013.01); H01R 13/4223 (2013.01); H01R 13/5202 (2013.01); H01R 13/5213 (2013.01); H01R 13/748 (2013.01); H05K 5/0013 (2013.01); H05K 5/0052 (2013.01); H05K 5/0247 (2013.01); H05K 5/03 (2013.01); H01R 2201/26 (2013.01);
Abstract

The present disclosure discloses a sealing element, a seal assembly and a receptacle. The sealing element comprises a pair of seal sidewalls that are arranged to be spaced from each other and a connecting top wall. Each of the seal sidewalls includes a pair of seal surfaces. The pair of seal sidewalls have the seal surfaces that are oppositely arranged. The connecting top wall is disposed between the pair of seal sidewalls and connects them integrally. The pair of seal sidewalls and the connecting top wall form a retaining groove. The sealing element of the present disclosure may provide a waterproof seal for multiple parts and can be readily assembled and save costs.


Find Patent Forward Citations

Loading…