The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Apr. 07, 2016
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Boe Optoelectronics Technology Co., Ltd., Hefei, CN;

Inventors:

Yajun Li, Beijing, CN;

Jun Zhang, Beijing, CN;

Zhihai Zhang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/24 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5246 (2013.01); H01L 51/5253 (2013.01); H01L 51/5259 (2013.01);
Abstract

A package structure, a packaging method and an organic light-emitting diode (OLED) device are provided. The package structure includes a first substrate and a second substrate which are arranged opposite to each other, and a sealant portion which is disposed between the first substrate and the second substrate, a first enclosed cavity being encircled by the first substrate, the second substrate and the sealant portion; a structure to be packaged being disposed in the first enclosed cavity; and a second enclosed cavity being disposed in the sealant portion and filled with hydrophobic liquid.


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