The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Feb. 05, 2018
Applicant:

Infineon Technologies Dresden Gmbh, Dresden, DE;

Inventors:

Steffen Bieselt, Stadt Wehlen, DE;

Heiko Froehlich, Radebeul, DE;

Thoralf Kautzsch, Dresden, DE;

Maik Stegemann, Pesterwitz, DE;

Mirko Vogt, Dresden, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/00 (2006.01); G01J 3/00 (2006.01); G01J 3/10 (2006.01); G01J 3/42 (2006.01);
U.S. Cl.
CPC ...
H01L 49/00 (2013.01); G01J 3/00 (2013.01); G01J 3/108 (2013.01); G01J 3/42 (2013.01);
Abstract

A method for manufacturing an emitter comprises providing a semiconductor substrate having a main surface, the semiconductor substrate comprising a cavity adjacent to the main surface. A portion of the semiconductor substrate arranged between the cavity and the main surface of the semiconductor substrate forms a support structure. The method comprises arranging an emitting element at the support structure, the emitting element being configured to emit a thermal radiation of the emitter, wherein the cavity provides a reduction of a thermal coupling between the emitting element and the semiconductor substrate.


Find Patent Forward Citations

Loading…