The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Oct. 12, 2016
Applicant:
Lg Electronics Inc., Seoul, KR;
Inventors:
Jinsung Kim, Seoul, KR;
Hyunho Lee, Seoul, KR;
Donghae Oh, Seoul, KR;
Woojoong Kang, Seoul, KR;
Jangho Kim, Seoul, KR;
Dongju Kang, Seoul, KR;
Kyuhyeok Sim, Seoul, KR;
Assignee:
LG ELECTRONICS INC., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01L 31/18 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 3/08 (2006.01); B23K 35/362 (2006.01); H01L 31/05 (2014.01); H01R 4/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/18 (2013.01); B23K 1/0016 (2013.01); B23K 1/203 (2013.01); B23K 3/082 (2013.01); B23K 35/362 (2013.01); H01L 31/05 (2013.01); H01L 31/0504 (2013.01); H01R 4/02 (2013.01); Y02E 10/50 (2013.01);
Abstract
Disclosed is a method for attaching an interconnector of a solar cell panel. The method includes forming a flux layer by spraying flux over the interconnector via spraying, the interconnector including a core layer and a solder layer formed on a surface of the core layer, and attaching the interconnector to a solar cell via soldering of the solder layer by pressing the interconnector onto the solar cell while applying heat.