The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Mar. 13, 2017
Applicant:

Sii Semicondutor Corporation, Chiba-shi, Chiba, JP;

Inventors:

Matsuo Kishi, Chiba, JP;

Miei Takahama (nee Sato), Chiba, JP;

Hiroshi Takahashi, Chiba, JP;

Mika Ebihara, Chiba, JP;

Takaaki Hioka, Chiba, JP;

Assignee:

ABLIC Inc., , JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/22 (2006.01); G01R 33/07 (2006.01); H01L 43/04 (2006.01); H01L 43/06 (2006.01); H01L 43/14 (2006.01);
U.S. Cl.
CPC ...
H01L 27/22 (2013.01); G01R 33/07 (2013.01); H01L 43/04 (2013.01); H01L 43/06 (2013.01); H01L 43/14 (2013.01);
Abstract

A semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in vertical cross-section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a portion having an approximate quadrant shape, and a portion contiguous to the approximate quadrant portion and substantially parallel to the semiconductor substrate.


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