The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Jan. 04, 2017
Applicant:

Infinera Corporation, Sunnyvale, CA (US);

Inventors:

Peter W. Evans, Tracy, CA (US);

John W. Osenbach, Kutztown, PA (US);

Fred A. Kish, Jr., Palo Alto, CA (US);

Jiaming Zhang, Macungie, PA (US);

Miguel Iglesias Olmedo, Sunnyvale, CA (US);

Maria Anagnosti, Mountain View, CA (US);

Assignee:

Infinera Corporation, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/00 (2006.01); G02B 6/12 (2006.01); G02B 6/42 (2006.01); G02F 1/21 (2006.01); G02F 1/225 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 31/02 (2006.01); H04B 10/40 (2013.01); H04B 10/50 (2013.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); G02B 6/00 (2013.01); G02B 6/12004 (2013.01); G02B 6/4274 (2013.01); G02F 1/2255 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5381 (2013.01); H01L 23/5386 (2013.01); H01L 24/09 (2013.01); H01L 24/49 (2013.01); H01L 31/02005 (2013.01); H04B 10/40 (2013.01); H04B 10/506 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/12123 (2013.01); G02B 2006/12135 (2013.01); G02B 2006/12147 (2013.01); G02F 2001/212 (2013.01); G02F 2201/127 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/15323 (2013.01);
Abstract

Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including an active optical element; an electrode configured to receive an electrical signal; a ground electrode; and a bond contact electrically coupled to the electrode; and an ASIC chip including circuitry configured to provide the electrical signal; and a bond contact that is electrically coupled to the circuitry; an bridge chip bonded to at least a portion of the photonic integrated circuit chip and at least a portion of the ASIC chip.


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