The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Jan. 03, 2018
Applicant:
Galatech, Inc., Milpitas, CA (US);
Inventors:
Wenjun Liu, Santa Clara, CA (US);
Robert James Ramm, Mountain View, CA (US);
Assignee:
GALATECH, INC., Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 25/11 (2006.01); H01L 23/50 (2006.01); H01L 23/482 (2006.01); H01L 21/60 (2006.01); H02M 7/537 (2006.01);
U.S. Cl.
CPC ...
H01L 25/115 (2013.01); H01L 21/50 (2013.01); H01L 23/4822 (2013.01); H01L 23/50 (2013.01); H01L 2021/60007 (2013.01); H02M 7/537 (2013.01);
Abstract
A packaged semiconductor device has a plurality of leads. A respective lead is to be welded to an electrical coupling that has a substantially rectangular end section. The end section has a width that is greater than a width of the respective lead. The respective lead is aligned within the width of the end section, such that the respective lead extends in a direction substantially perpendicular to the width of the end section. With the respective lead and the end section aligned, the respective lead is welded to the end section.