The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Jul. 31, 2015
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventor:
Yeong Deuk Jo, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/20 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 29/778 (2006.01); H01L 29/872 (2006.01); H01L 33/38 (2010.01); H01L 29/20 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 21/20 (2013.01); H01L 24/03 (2013.01); H01L 29/417 (2013.01); H01L 29/41725 (2013.01); H01L 29/42316 (2013.01); H01L 29/7786 (2013.01); H01L 29/872 (2013.01); H01L 33/38 (2013.01); H01L 29/2003 (2013.01); H01L 33/387 (2013.01); H01L 33/62 (2013.01); H01L 2224/0382 (2013.01); H01L 2224/03848 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05016 (2013.01); H01L 2224/05023 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05171 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48453 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/13063 (2013.01); H01L 2924/13064 (2013.01);
Abstract
A semiconductor device according to an embodiment comprises a substrate, an epitaxial layer on the substrate, and a cluster including a plurality of particles disposed on the epitaxial layer, the particles being disposed to be apart from each other, and contacting the epitaxial layer.