The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Jul. 28, 2016
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Cyril Cabral, Jr., Yorktown Heights, NY (US);
Kenneth P. Rodbell, Sandy Hook, CT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); C06B 43/00 (2006.01); C06B 45/10 (2006.01); C06B 45/14 (2006.01); H01L 23/00 (2006.01); H01L 23/58 (2006.01); H01L 27/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/576 (2013.01); C06B 43/00 (2013.01); C06B 45/10 (2013.01); C06B 45/14 (2013.01); H01L 23/573 (2013.01); H01L 23/585 (2013.01); H05K 1/185 (2013.01); H01L 27/2472 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A method comprising bonding a first substrate to a second substrate. The first substrate includes a layer of one or more pairs of reactive material. The method comprising triggering a reaction between the one or more pairs of reactive material and fragmenting the second substrate.