The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Dec. 12, 2016
Applicant:

Melexis Technologies SA, Bevaix, CH;

Inventors:

Robert Racz, Zug, CH;

Bruno Boury, Kontich, BE;

Antonino Cacciato, Heverlee, BE;

Jian Chen, Heist op den Berg, BE;

Guido Dupont, Bevaix, CH;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/768 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/552 (2006.01); G01R 15/20 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); G01R 15/207 (2013.01); H01L 21/4825 (2013.01); H01L 21/4842 (2013.01); H01L 21/565 (2013.01); H01L 21/76898 (2013.01); H01L 23/3114 (2013.01); H01L 23/481 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/552 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract

A current sensor comprises a current conductor having a first portion, a measuring portion and a second portion, the first portion including one or more first electrical terminals and the second portion including one or more second electrical terminals. The current sensor further comprises third electrical terminals and a semiconductor chip. The semiconductor chip has one or more magnetic field sensors disposed in the active surface, is mounted on the current conductor with an active surface facing the current conductor. The active surface comprises first contacts. The semiconductor chip comprises electrical through silicon connections disposed over and electrically connected to the first contacts. A backside of the semiconductor chip comprises second contacts, each of the second contacts electrically connected to one of the electrical through silicon connections. Wire bonds electrically connect the second contacts with the third electrical terminals.


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