The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Apr. 29, 2014
Applicant:

John Cleaon Moore, Camirillo, CA (US);

Inventors:

John Cleaon Moore, Camirillo, CA (US);

Jared Pettit, Camarillo, CA (US);

Alman Law, Camarilo, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/02 (2006.01); B32B 7/06 (2019.01); B32B 17/10 (2006.01); B32B 18/00 (2006.01); B32B 25/00 (2006.01); B32B 17/06 (2006.01); B32B 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B32B 7/06 (2013.01); B32B 17/06 (2013.01); B32B 17/1077 (2013.01); B32B 17/10724 (2013.01); B32B 17/10733 (2013.01); B32B 17/10743 (2013.01); B32B 17/10798 (2013.01); B32B 18/00 (2013.01); B32B 25/00 (2013.01); B32B 27/06 (2013.01); H01L 21/6835 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68377 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68386 (2013.01);
Abstract

Compositions and methods are described for a release layer that is affixed directly onto a carrier or with the use of an interfacial adhesive layer to fabricate a flexible work product, and upon completion, the release layer is removed by an external applied force of a given value that overcomes the adhesive force without harm to the work product. The release layer serves as a permanent support for the manufacture of flexible electronic devices and upon completion offers a simple means to achieve a wide range of thin and ergonomically pleasing options for the consumer. The invention provides benefits of flexibility in choosing a host of materials to meet the needs of a specific manufacturing objective and rapidly moving towards the next step in the manufacture of semiconductors and flat panel displays.


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