The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Sep. 06, 2017
Applicants:

Lite-on Electronics (Guangzhou) Limited, Guangzhou, CN;

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Yi-Feng Pu, Taipei, TW;

Po-Yu Cheng, Taipei, TW;

Tzu-Shu Lin, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/28 (2006.01); H05K 1/02 (2006.01); H05K 3/12 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); H01L 21/56 (2013.01); H01L 23/3135 (2013.01); H05K 1/0209 (2013.01); H05K 1/185 (2013.01); H05K 3/1275 (2013.01); H05K 3/1283 (2013.01); H05K 3/284 (2013.01); H05K 3/30 (2013.01); H01L 23/3121 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1377 (2013.01);
Abstract

An electronic product including a supporting structure, a first thermo-formable film, a conductive circuit and a protection layer is provided. The conductive circuit is formed on the first thermo-formable film, and an electronic component is mounted on the conductive circuit. The protection layer covers the electronic component, and includes a second thermo-formable film. The conductive circuit and the electronic component are enclosed between the first thermo-formable film and the second thermo-formable film, and the supporting structure, the first thermo-formable film and the protection layer are bonded and stacked to each other.


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