The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Jul. 14, 2016
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Satoshi Shindo, Nagaokakyo, JP;
Yutaka Takeshima, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;
Abstract
A composite electronic component that includes an insulation substrate having a principal surface; a thin-film capacitor on the principal surface of the insulation substrate; a laminated insulation protection layer covering the thin-film capacitor; a first extended wiring in the insulation protection layer and connected to the thin-film capacitor; a first resin layer on the insulation protection layer, first and second thin-film resistors in the first resin layer; a through-hole penetrating the first resin layer in a thickness direction thereof so as to expose the first extended wiring; a first rewiring in the first resin layer and connected to the first extended wiring through the through-hole; and a second resin layer on the first resin layer. The interior of the through-hole is filled with the second resin layer, and the through-hole does not overlap the thin-film capacitor.