The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Mar. 13, 2017
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventor:

Masaki Yoneda, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 1/012 (2006.01); H01C 1/142 (2006.01); H01C 17/00 (2006.01); H01C 17/28 (2006.01); H01C 1/148 (2006.01); H01C 7/00 (2006.01); H01C 17/242 (2006.01);
U.S. Cl.
CPC ...
H01C 1/142 (2013.01); H01C 1/012 (2013.01); H01C 1/148 (2013.01); H01C 7/003 (2013.01); H01C 17/006 (2013.01); H01C 17/288 (2013.01); H01C 17/242 (2013.01); H01C 17/281 (2013.01);
Abstract

The present invention provides a chip resistor and a method of making the same for alleviating stress resulted from thermal expansion difference and thus suppressing cracks. A chip resistor includes: a substrate, having a carrying surface and a mounting surface facing away from each other; a pair of upper electrodes, disposed at two ends of the carrying surface; a resistor, disposed on the carrying surface and between the pair of upper electrodes, and electrically connected to the pair of upper electrodes; a stress relaxation layer having flexibility and formed on the mounting surface of the substrate; a metal thin film layer, formed on a surface of the stress relaxation layer opposite to the substrate; a side electrode for electrically connecting the upper electrodes and the metal thin film layer; and a plating layer covering the side electrode and the metal thin film layer.


Find Patent Forward Citations

Loading…