The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

May. 09, 2018
Applicant:

Guangdong Oppo Mobile Telecommunications Corp., Ltd., Dongguan, Guangdong, CN;

Inventors:

Shoukuan Wu, Guangdong, CN;

Zanjian Zeng, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); G06K 9/00 (2006.01); H04M 1/02 (2006.01); H04M 1/18 (2006.01); H05K 1/11 (2006.01); H01L 23/00 (2006.01); H01L 23/10 (2006.01); G06F 3/0354 (2013.01);
U.S. Cl.
CPC ...
G06K 9/00053 (2013.01); G06F 1/1637 (2013.01); G06F 1/1684 (2013.01); G06F 3/03547 (2013.01); H01L 23/10 (2013.01); H01L 24/06 (2013.01); H04M 1/0202 (2013.01); H04M 1/026 (2013.01); H04M 1/18 (2013.01); H05K 1/11 (2013.01); G06F 2203/0338 (2013.01);
Abstract

The present disclosure provides a fingerprint chip package structure and a terminal. The fingerprint chip package structure includes a package body and a fingerprint identification chip. The package body includes a bottom surface and a lateral surface connected to the bottom surface, and defines a recessed portion at a junction of the bottom surface and the lateral surface. The fingerprint identification chip is received in the package body. The package body packages the fingerprint identification chip therein. The package body includes a first package portion and a second package portion coupled to the first package portion. The first package portion includes the bottom surface, and the second package portion includes the lateral surface. The fingerprint chip package structure is configured to be received in a decoration enclosure.


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