The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10288118 B1

Date of Patent:

May. 14, 2019

Filed:

Mar. 08, 2018

Sliding member

Applicant:

Daido Metal Company Ltd., Nagoya, JP;

Inventor:

Kazuaki Toda, Inuyama, JP;

Assignee:

DAIDO METAL COMPANY LTD., Nagoya, JP;

Attorney:

Snyder, Clark, Lesch & Chung, LLP

Primary Examiner:

Michael E La Villa

Int. Cl.

CPC ...

F16C 33/12 (2006.01); F16C 17/10 (2006.01); B32B 15/01 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B22D 19/08 (2006.01); B22D 27/04 (2006.01); C22C 9/02 (2006.01); C22C 9/00 (2006.01); C23C 30/00 (2006.01); C23C 28/00 (2006.01); C23C 28/02 (2006.01); B22D 13/02 (2006.01); F16C 33/14 (2006.01);

U.S. Cl.

CPC ...

F16C 33/121 (2013.01); B22D 13/023 (2013.01); B22D 19/085 (2013.01); B22D 27/045 (2013.01); B32B 15/015 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); C22C 9/00 (2013.01); C22C 9/02 (2013.01); C23C 28/021 (2013.01); C23C 28/36 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); F16C 17/10 (2013.01); F16C 33/124 (2013.01); F16C 33/14 (2013.01); F16C 2202/50 (2013.01); F16C 2204/10 (2013.01); F16C 2204/12 (2013.01); F16C 2204/18 (2013.01); F16C 2223/44 (2013.01); F16C 2240/60 (2013.01); F16C 2360/22 (2013.01); Y10T 428/1291 (2015.01); Y10T 428/12458 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/12917 (2015.01); Y10T 428/12924 (2015.01); Y10T 428/12993 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/263 (2015.01); Y10T 428/264 (2015.01); Y10T 428/265 (2015.01); Y10T 428/27 (2015.01); Y10T 428/273 (2015.01);

Abstract

Provided is a sliding material including a substrate; and a copper alloy layer bonded to the substrate. The copper alloy includes 2.0 to 15.0% by mass of tin. The copper alloy layer includes a sliding body part including a sliding surface, and a gradient region including a bond surface with the substrate. A tin concentration in the gradient region reduces from the sliding body part toward the bond surface. A method for producing the siding material is also provided. The method includes preparing the substrate having a first surface and a second surface opposite to the first surface; melting the copper alloy; casting the molten copper alloy on the first surface of the substrate; and solidifying the copper alloy unidirectionally by cooling the substrate from the second surface by a coolant.

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