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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10287651 B1

PDFFull Text
Date of Patent:
May. 14, 2019

Filed:

Jul. 08, 2015

Thermal reduction apparatus for metal production, gate device, condensing system, and control method thereof

Applicant:

Research Institute of Industrial Science & Technology, Pohang, KR;

Inventors:

Dong Kyun Choo, Pohang, KR;

Young Il Kim, Pohang, KR;

Kil Won Cho, Pohang, KR;

Wung Yong Choo, Pohang, KR;

Jong Min Park, Pohang, KR;

Jae Sin Park, Gangneung, KR;

Gilsoo Han, Gangneung, KR;

Good-Sun Choi, Gangneung, KR;

Gyu Chang Lee, Gangneung, KR;

Dae Kyu Park, Gangneung, KR;

Moon Chul Kim, Seoul, KR;

Assignee:

RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE & TECHNOLOGY, Pohang-si, KR;

Attorney:

Lex IP Meister, PLLC

Primary Examiner:

Scott R Kastler

Assistant Examiner:

Michael Aboagye

Int. Cl.
CPC ...
F27B 19/02 (2006.01); C22B 1/00 (2006.01); C22B 9/04 (2006.01); F27D 13/00 (2006.01); F27D 15/02 (2006.01); C22B 5/16 (2006.01); F27D 7/06 (2006.01); C22B 26/22 (2006.01); F27D 3/04 (2006.01); F27D 3/12 (2006.01); F27D 99/00 (2010.01); F27B 9/02 (2006.01); F27B 9/04 (2006.01); F27B 9/24 (2006.01); F27B 9/40 (2006.01); F27B 17/00 (2006.01);
U.S. Cl.
CPC ...
C22B 5/16 (2013.01); C22B 26/22 (2013.01); F27B 9/028 (2013.01); F27B 9/042 (2013.01); F27B 9/2407 (2013.01); F27B 9/40 (2013.01); F27D 3/04 (2013.01); F27D 3/12 (2013.01); F27D 99/0073 (2013.01); F27B 2017/0091 (2013.01); F27D 7/06 (2013.01);
Abstract

Disclosed is a thermal reduction apparatus. The thermal reduction apparatus according to the exemplary embodiment includes: a preheating unit which preheats a to-be-reduced material and loads the to-be-reduced material into a reducing unit; the reducing unit which is connected to the preheating unit and in which a thermal reduction reaction of the to-be-reduced material occurs; a cooling unit which is connected to the reducing unit and from which the to-be-reduced material flowing into the cooling unit is unloaded to the outside; a gate device which is installed between the preheating unit and the reducing unit; a gate device which is installed between the reducing unit and the cooling unit; a condensing device which is connected to the reducing unit and condenses a metal vapor; a first blocking unit which is installed in the reducing unit; and a second blocking unit which is installed in the reducing unit so as to be spaced apart from the first blocking unit.

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