The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Oct. 18, 2016
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventors:
Wangsheng Fang, Shanghai, CN;
Wei Yao, Shanghai, CN;
Assignee:
HENKEL AG & CO. KGAA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 9/00 (2006.01); C09D 5/24 (2006.01); C09D 5/32 (2006.01); H01L 23/552 (2006.01); C09D 163/00 (2006.01); H01B 1/22 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
C09D 5/32 (2013.01); C09D 5/24 (2013.01); C09D 163/00 (2013.01); H01B 1/22 (2013.01); H01L 23/552 (2013.01); H05K 9/0083 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract
This invention relates to an EMI shielding composition comprising a thermoplastic resin and/or a thermoset resin, a solvent or a reactive diluent and conductive particles providing uniform and homogenous thickness to the EMI shielding layer. The invention also provides a process of applying the EMI shielding layer on the encapsulant protecting the CI device components.