The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Dec. 13, 2012
Applicant:

Heraeus Precious Metals North America Conshohocken Llc, West Conshohocken, PA (US);

Inventors:

Hong Jiang, Irvine, CA (US);

Aziz S. Shaikh, San Diego, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 5/24 (2006.01); C09D 151/08 (2006.01); C09D 175/16 (2006.01); H01L 31/0376 (2006.01); H01L 31/0224 (2006.01); H01L 31/18 (2006.01); C08G 18/80 (2006.01); C08G 18/67 (2006.01); C08F 290/06 (2006.01); H01B 1/22 (2006.01); H01B 1/02 (2006.01); C08K 9/10 (2006.01); C08F 222/10 (2006.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); C08F 290/064 (2013.01); C08G 18/673 (2013.01); C08G 18/8093 (2013.01); C08K 9/10 (2013.01); C09D 151/08 (2013.01); C09D 175/16 (2013.01); H01B 1/02 (2013.01); H01B 1/22 (2013.01); H01L 31/022425 (2013.01); H01L 31/1884 (2013.01); C08K 2201/001 (2013.01); H01L 31/03762 (2013.01); Y02E 10/50 (2013.01);
Abstract

Electrically conductive polymeric compositions adapted for use in forming electronic devices are disclosed. The compositions are thermally curable at temperatures less than about 250° C. Compositions are provided which may be solvent-free and so can be used in processing or manufacturing operations without solvent recovery concerns. Core-shell conductive particles provide the conductivity of the compositions and devices contemplated herein.


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